Light emitting device

ABSTRACT

A light emitting device includes a base member including a resin-molded body having an upper surface, a lower surface and a front surface, and formed with a groove-shaped recess in the front surface across the front surface from the upper surface to the lower surface. A lead can be embedded in the resin-molded body. A light emitting element is provided, and can include a light emitting element chip and a reflecting layer limiting a light-emitting region to a predetermined range. The reflecting layer can be disposed on or over a side surface of the light emitting element. The light emitting element is disposed on a bottom surface of the recess such that the reflecting layer is spaced apart from a side wall of the recess.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.14/468,755 filed on Aug. 26, 2014, which claims priority of JapanesePatent Application No. 2013-177773, filed on Aug. 29, 2013. The entiredisclosure of these earlier applications are hereby incorporated hereinby reference.

BACKGROUND 1. Field

The disclosure relates to a light emitting device.

2. Description of the Related Art

A light emitting device employing a light emitting diode has been widelyused as a backlight source for an image display device. One example of alight emitting device as a backlight source for an image display deviceis provided with a light guide plate and a light emitting devicedisposed on a side surface of the light guide plate, and configured toemit light emitted from the light emitting device through alight-emitting surface of the light guide plate. Further, as a lightemitting device used as a backlight source for an image display deviceused for a mobile terminal, a side-view type (side surface emissiontype) light emitting device, as disclosed in JP2010-3743 A, in which amounting surface and a light-emitting surface are perpendicular to eachother and its side surface constitutes a light extracting surface hasbeen widely used. Such a light emitting device as a backlight source foran image display device used for a mobile terminal is required to becapable of efficiently extracting light from the light emitting elementto a front side, as well as to be small, lightweight, and thin.

As mobile terminals become thinner, even thinner side-view type lightemitting devices have become demanded.

SUMMARY

Thus, an object of the present invention is to provide a small and thinside-view type light emitting device capable of efficiently extractinglight from a light emitting element to a front side.

In order to achieve the above object, a light emitting device accordingto an embodiment of the present invention can include a base membercomprising a resin-molded body having an upper surface, a lower surface,and a front surface having a recess formed in a groove-shaped from theupper surface to the lower surface. A lead can be embedded in theresin-molded body. A light emitting element can be included, having alight emitting element chip and a reflecting layer limiting alight-emitting region to a predetermined range. The reflecting layer canbe disposed on or over a side surface of the light emitting element. Thelight emitting element is disposed on a bottom surface of the recess.

According to the light emitting device thus configured, it is possibleto provide a small and thin side-view type light emitting device capableof efficiently extracting light from the light emitting element to afront side.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view showing a configuration of a light emittingdevice of an embodiment according to the present invention.

FIG. 2 is a perspective view showing a front surface side of a basemember 20 of the embodiment.

FIG. 3 is a perspective view showing a configuration of a first lead anda second lead embedded in the base member of the embodiment.

FIG. 4 is a perspective view showing a rear surface side of the basemember 20 of the embodiment.

FIGS. 5A-5C are sectional views showing a process of manufacturing alight emitting element used in the light emitting device of theembodiment.

DETAILED DESCRIPTION

Hereinafter, a light emitting device of embodiments of the presentinvention will be described with reference to the drawings.

FIG. 1 is a perspective view showing a configuration of the lightemitting device of an embodiment of the present invention. FIG. 2 is aperspective view showing a configuration of a base member 20 with afirst surface 23 a as a mounting surface upward.

Referring to FIG. 1, the light emitting device can include the basemember 20 having a recess 24, and a light emitting element 10 disposedon a bottom surface 24 b of the recess in the base member 20.

Base Member 20

The base member 20 includes a resin-molded body 23, and a first lead 21and a second lead 22 that are embedded in the resin-molded body 23.

The resin-molded body 23 includes the first surface 23 a which is one oftwo opposing main surfaces, a second surface 23 b which is the other ofthe two opposing main surfaces, a front surface 23 c, a rear surface 23f, a first end surface 23 d, and a second end surface 23 e, as well asthe groove-shaped recess 24 in the front surface 23 c. As describedabove, in FIG. 1 and other drawings, the first surface 23 a as amounting surface is shown upside. Accordingly, in a mounted state, thefirst surface 23 a corresponds to a lower surface and the second surface23 b corresponds to an upper surface. The recess 24 is formed in thefront surface 23 c across the front surface 23 c so as to penetrate fromthe first surface 23 a to the second surface 23 b, and includes thebottom surface 24 b of the recess and two side walls 24 a. The sidewalls 24 a of the recess are preferably inclined such that an openingside of the recess is greater than the recess bottom surface 24 b.Mounting of the light emitting element may be facilitated by making theopening side greater.

According to the resin-molded body 23, the first surface 23 a includes astepped portion on each of a side of the first end surface 23 d and aside of the second end surface 23 e, and the resin-molded body 23becomes thin at the stepped portion. In the first surface 23 a, a partexcluding inclined surfaces 23 ac and flat surfaces 23 ab that arecontinuous from the corresponding inclined surfaces 23 ac thatconstitute the stepped portions on the side of the first end surface 23d and the side of the second end surface 23 e is referred to as a mountsurface 23 as.

Examples of a material for molding the resin-molded body 23 can includea thermoplastic resin and a thermosetting resin, and more specifically,resins such as polyphthalamide (PPA), a polycarbonate resin,polyphenylenesulfide (PPS), liquid crystal polymer (LCP), an ABS resin,an epoxy resin, a phenolic resin, an acrylic resin, and a PBT resin.Further, it is possible to improve reflectance of light on the surfaceof the resin-molded body by mixing a light-reflective material such astitanium oxide into the material for molding. With this, it is possibleto cause returning light to be efficiently reflected.

As illustrated in FIG. 3, the first lead 21 includes one end surface 21e and the other end surface 21 f The first lead 21 is formed in a pillarshape of a substantial hexahedron elongated in a direction from the oneend surface 21 e to the other end surface 21 f. The first lead 21includes four side surfaces 21 a, 21 b, 21 c, and 21 d between the oneend surface 21 e and the other end surface 21 f FIG. 3 shows the firstlead 21 and the second lead 22 with their positional relation within theresin-molded body 23 maintained.

The first lead 21 is embedded in the resin-molded body 23 such that theone end surface 21 e is exposed at a central portion of the first endsurface 23 d of the resin-molded body 23, and a part of the side surface21 b on a side of the one end surface 21 e is exposed from the inclinedsurface 23 ac and the flat surface 23 ab of the first surface 23 a ofthe resin-molded body 23. A part of the side surface 21 a of the firstlead 21 on a side of the other end surface 21 f is exposed at the bottomsurface 24 b of the recess of the resin-molded body 23. A recess 21 g isprovided in the side surface 21 c of the first lead 21, and the recessprevents the first lead 21 from falling out of the resin-molded body 23.

As illustrated in FIG. 3, the second lead 22 includes one end surface 22e and the other end surface 22 f The second lead 22 is formed in apillar shape of substantial hexahedron elongated in a direction from theone end surface 22 e to the other end surface 22 f. The second lead 22includes four side surfaces 22 a, 22 b, 22 c, and 22 d between the oneend surface 22 e and the other end surface 22 f.

As illustrated in FIG. 1, the second lead 22 is embedded in theresin-molded body 23 such that the one end surface 22 e is exposed at acentral portion of the second end surface 23 e of the resin-molded body23, and a part of the side surface 22 b on a side of the one end surface22 e is exposed from the inclined surface 23 ac and the flat surface 23ab of the first surface 23 a of the resin-molded body 23. A part of theside surface 22 a of the second lead 22 on a side of the other endsurface 22 f is exposed at the bottom surface 24 b of the recess of theresin-molded body 23. A recess 22 g is provided in the side surface 22 cof the second lead 22, and the recess prevents the second lead 22 fromfalling out of the resin-molded body 23.

According to the light emitting device of this embodiment, the firstlead 21 is embedded in the resin-molded body 23 such that the part ofthe side surface 21 b on the side of the one end surface 21 e is exposedfrom the resin-molded body 23, and the second lead 22 is embedded in theresin-molded body 23 such that the part of the side surface 22 b on theside of the one end surface 22 e is exposed from the resin-molded body23. However, the present invention is not limited to such an example,and the first lead 21 and the second lead 22 may be embedded in theresin-molded body 23 such that, for example, the side surface 21 b onthe side of the other end surface 21 f and the side surface 22 b on theside of the other end surface 22 f are exposed while positioned in thesame plane as the mount surface 23 as. Alternatively, the first lead 21and the second lead 22 may be embedded in the resin-molded body 23 suchthat the side surface 21 b on the side of the other end surface 21 f andthe side surface 22 b on the side of the other end surface 22 f areexposed while extending from the mount surface 23 as.

As illustrated in FIG. 3, in some embodiments of the present invention,each of the first lead 21 and the second lead 22 is formed in a pillarshape of substantial hexahedron elongated in one direction. The part ofthe side surface 21 a on the side of the other end surface 21 f isexposed at the bottom surface 24 b of the recess, and the part on theside of the one end surface 21 e of the side surface 21 b that isperpendicular to the side surface 21 a is constituted as a main externalconnection surface for connecting to an external circuit. The part ofthe side surface 22 a on the side of the other end surface 22 f isexposed at the bottom surface 24 b of the recess, and the part on theside of the one end surface 22 e of the side surface 22 b that isperpendicular to the side surface 22 a is constituted as a main externalconnection surface for connecting to an external circuit.

In this manner, according to some embodiments of the present invention,by forming each of the first lead 21 and the second lead 22 in a pillarshape of substantial hexahedron, it is possible to use one of the twoside surfaces that are perpendicular to each other for connection withthe light emitting element 10, and the other of the two side surfaces asthe external connection surface, and thus to improve heat radiationcharacteristics.

The first lead and the second lead may be made of a conductive materialincluding at least one of aluminum, iron, nickel, copper, a copperalloy, stainless steel, and a ferro-alloy including Invar alloy, forexample. A clad material having a cladding of different types of metalsmay also be used. Further, it is preferable that a surface of a leadframe be plated by gold, silver, nickel, palladium, or an alloy of thesemetals

Moreover, a thickness of the lead frame is, for example, from 50 μm to1000 μm, and preferably, from 100 μm to 500 μm. In addition, thethickness of the lead frame may be changed depending on the purpose. Itis possible to change the thickness of the lead frame by etching (halfetching) or press working.

The base member 20 thus configured may be manufactured in the followingmanner, for example.

First, a mold having a cavity corresponding to the shape of theresin-molded body 23 is prepared. Then, two columnar leads that are tobe the first lead 21 and the second lead 22 are positioned in the cavityand fixed at a predetermined distance between their ends. The ends ofthe columnar leads positioned at the predetermined distance respectivelycorrespond to the other end surface 21 f and the other end surface 22 fillustrated in FIG. 3.

For example, the mold is configured by two or more molds that areseparable, and one of the molds includes a projection corresponding tothe recess 24, and the other of the molds includes a gate for injectinga resin.

Next, a resin is injected into the cavity in which the first lead 21 andthe second lead 22 are fixed, and the resin is hardened.

After hardening the resin, the resin-molded body is taken out of themold, and the columnar leads that extend outside the resin-molded body23 are cut.

The columnar first lead 21 and the columnar second lead 22 are cut alongthe first end surface 23 d and the second end surface 23 e (parallelly)such that the ends on the side of the one end surface 21 e and the oneend surface 22 e project from the resin-molded body 23 by apredetermined length. In this manner, the one end surfaces 21 e and 22 erespectively constituted by cutting surfaces are provided. The one endsurface 21 e constituted by the cutting surface is preferablyperpendicular to the four side surfaces 21 a, 21 b, 21 c, and 21 d, andthe one end surface 22 e constituted by the cutting surface ispreferably perpendicular to the four side surfaces 22 a, 22 b, 22 c, and22 d.

In FIG. 4, a portion represented by 28 is a gate trace of theresin-molded body 23.

The base member 20 thus configured is provided with the recess 24housing the light emitting element so as to penetrate from the firstsurface 23 a to the second surface 23 b, and its thickness (a distancebetween the first surface 23 a and the second surface 23 b) may be thinas there is no walls on the side of the first surface 23 a and on theside of the second surface 23 b (hereinafter, referred to as upper andlower walls).

However, as the recess 24 has no upper and lower walls, light from thelight emitting element may leak from the side of the first surface 23 aand the side of the second surface 23 b, and it is not possible toefficiently extract light emitted from the light emitting element to afront side.

Therefore, embodiments of the present invention realize a thin lightemitting device capable of efficiently extracting light from the lightemitting element to the front side, by using a light emitting elementhaving a reflecting layer provided on the side surfaces.

Light Emitting Element 10

Examples of the light emitting element 10 can include a light emittingelement chip 11, a light transmissive member 12 disposed on alight-emitting surface of the light emitting element chip 11, and areflecting layer 13 covering an periphery of the light emitting elementchip 11 and an periphery of the light transmissive member 12. The lightemitting element 10 can be configured such that a side surface of aquadrangular prismatic body defined by a chip mounting surface of thelight emitting element chip 11 on which a positive electrode 3 a and anegative electrode 3 b are provided, an upper surface of the lighttransmissive member 12, and side surfaces that are perpendicular to theupper surface and the chip mounting surface are covered by thereflecting layer 13, and an outer shape of the light emitting element 10including the reflecting layer 13 is also in a quadrangular prismaticbody. Hereinafter, the quadrangular prismatic body excluding thereflecting layer 13 is referred to as an inner quadrangular prismaticbody, and the quadrangular prismatic body including the reflecting layer13 is referred to as an outer quadrangular prismatic body. According toembodiments of the present invention, the shape of the light emittingelement 10 is not limited to quadrangular prismatic body, butmanufacturing of the light emitting element 10 is facilitated when theshape of the light emitting element 10 is a quadrangular prismatic body.In the following, one example of a method of manufacturing the lightemitting element 10 will be described.

Preparation of Light Emitting Element Chip

The light emitting element chip 11 having the positive electrode 3 a andthe negative electrode 3 b on the same surface is prepared.

The light emitting element chip 11 may be any light emitting element aslong as a light-emitting layer made of semiconductor is provided. Inparticular, a light emitting element having a light-emitting layer madeof nitride semiconductor, especially gallium nitride-based compoundsemiconductor (particularly InGaN) may be suitably combined with aphosphor, as this type of light emitting element is able to emit intenselight in a short wavelength region and a near-ultraviolet region in avisual light range. Desirably, a light emission peak wavelength ofoutgoing light emitted from light-emitting layer of the light emittingelement chip 11 has a light emission spectrum around 240 nm to 500 nmwhich is in the short wavelength region from the near-ultraviolet lightto visible light, preferably 380 nm to 420 nm, and more preferably 450nm to 470 nm. A light emitting element emitting light in this wavelengthregion is able to emit light of a desired color, in particular whitelight, in combination with a phosphor of various types. Alternatively,the light emitting element 10 may have a light-emitting layer made ofsuch as ZnSe-based, InGaAs-based, or AlInGaP-based semiconductor.

Preparation of Light Transmissive Member

The light transmissive member 12 provided with a light transmissivesubstrate 1 and a wavelength conversion layer 2 disposed on one surfaceof the light transmissive substrate 1 is prepared.

Specifically, a wavelength conversion member is disposed on the lighttransmissive substrate, and cut into the same size as the light emittingelement chip 11, for example.

Examples of the light transmissive substrate 1 include glass substratesmade of quartz and borosilicate glass. A thickness of the lighttransmissive substrate 1 is preferably from 30 μm to 1 mm, and morepreferably from 50 μm to 500 μm.

As the wavelength conversion layer 2, a binder resin mixed with aphosphor described later may be used.

The phosphor is selected from phosphors excited by light emitted fromthe light emitting element chip 11. If, for example, the light emittingelement chip 11 is a blue light emitting element and it is desired toconfigure a white light emitting device, it is preferable to use aphosphor that is excited by blue light and exhibits yellow broad lightemission. Examples of such a phosphor include phosphors having acerium-activated garnet structure (in particular, a phosphor activatedby cerium, containing aluminum, and having a garnet structure). As acerium-activated phosphor exhibits yellow broad light emission, it ispossible to realize white light with favorable color renderingproperties in combination with blue light emission. A phosphor having agarnet structure, in particular, a phosphor containing aluminum andhaving a garnet structure is resistant to heat, light, and moisture, andis able to maintain yellow light emission at high brightness for anextended period of time. For example, it is preferable to use, as thephosphor, a YAG-based phosphor (generally abbreviated to YAG) expressedby (Re_(1-x)Sm_(x))₃(Al_(1-y)Ga_(y))₅O₁₂:Ce (0≤x<1, 0≤y≤1, where Re isat least one of elements selected from a group consisting of Y, Gd, La,Lu, and Tb). Further, other than the yellow phosphor, a phosphor such asSi_(6-Z)Al_(Z)O_(Z)N_(8-Z):Eu, Lu₃Al₅O₁₂:Ce, BaMgAl₁₀O₁₇:Eu,BaMgAl₁₀O₁₇:Eu, Mn, (Zn, Cd)Zn:Cu, (Sr, Ca)₁₀(PO₄)₆C₁₂:Eu, Mn, (Sr,Ca)₂Si₅N₈:Eu, CaAlSiB_(x)N_(3+x):Eu, K₂SiF₆:Mn, or CaAlSiN₃:Eu is usedto adjust color rendering properties of a light source for lighting andcolor reproducibility in use of backlight. Alternatively, a quantum dotphosphor may also be used.

When a light emission wavelength of the light emitting element chip 11is a short wavelength, the wavelength conversion layer 2 may includemore than two types of phosphors. A first type of the phosphors may beexcited by primary light from the light emitting element chip 11 to emitlight, and a second type of the phosphors may be excited by secondarylight emitted from the first type of the phosphors to emit light. Inaddition, when two types of phosphors of different chromaticity areused, by adjusting amounts of the two types of phosphors, it is possibleto achieve light emission corresponding to an arbitrary chromaticitypoint within a region defined by connecting chromaticity point of eachof the two types of phosphors and the light emitting element on achromaticity diagram.

As the binder resin, a silicone resin or a modified silicone resin canbe used. In addition, an insulating resin having light transmissivitysuch as an epoxy resin, a modified epoxy resin, or an acrylic resin maybe used. Further, a resin having a superior weather resistance such as ahybrid resin including at least one of these resins may also be used.

Examples of a method of providing the wavelength conversion layer 2include known methods such as printing, spray coating, compressionmolding, spin coat, and dispensing.

It is preferable that the wavelength conversion layer 2 be provided suchthat a film thickness is uniform and phosphor particles may not beeccentrically located. Among the above listed methods of providing aphosphor layer, it is preferable to use printing, spray coating, orcompression molding.

Step of Arranging Light Emitting Element Chips

As illustrated in FIG. 5(a), light emitting element chips 11 arearranged on a sheet 6 in matrix at predetermined intervals with asurface having the positive electrode 3 a and the negative electrode 3 bdownside. Here, the predetermined intervals at which the light emittingelement chips 11 are arranged are set considering a thickness t of thereflecting layer 13. Specifically, the intervals are set to a valueobtained by adding a value that is twice as large as the thickness t ofthe reflecting layer 13 with a cutting width that will be laterdescribed. Further, the sheet 6 is provided with an adhesive layer or asticking layer, for example, on one surface, and the light emittingelement chips 11 are maintained at the predetermined intervals by theadhesive layer or the sticking layer.

Step of Joining Light Transmissive Member

As illustrated in FIG. 5(b), the light transmissive member 12 having thewavelength conversion layer 2 is joined onto each of the light emittingelement chips 11 by an adhesive member 4.

For example, the light transmissive substrate 1 is manufactured in aplanar shape of a size that is the same as or slightly larger than thelight emitting element chip 11, and the wavelength conversion layer 2 isjoined to the light emitting element chip 11 via the adhesive member 4made for example of a silicone resin. Through the above steps, aplurality of inner quadrangular columnar bodies each having the lightemitting element chip 11 and the light transmissive member 12 arearranged on the sheet 6.

Step of Filling Resin

As illustrated in FIG. 5(c), a resin 5 constituting the reflecting layer13 is applied such that the resin 5 is filled between the arranged innerquadrangular columnar bodies.

A light-reflective material is contained in the resin 5. With this, itis possible to improve light emission efficiency by reflecting lightemitted from the side surfaces of the light emitting element chip 11 bythe light-reflective material contained in the resin 5 toward thewavelength conversion layer 2. At least one selected from a groupconstituting of TiO₂, ZrO₂, Nb₂O₅, Al₂O₃, MgF, AlN, SiO₂, and MgO may beused as the light-reflective material.

For example, the resin 5 containing the light-reflective material isfilled between the arranged light emitting elements chip 11 by applyingthe resin 5 and spreading the resin 5 using a squeegee. At this time,the squeegee is moved along the upper surface of the light transmissivesubstrate 1 of the light transmissive member 12, and causes the resin 5to fill between the light emitting element chips 11 such that the uppersurface of the resin 5 and the upper surface of the light transmissivesubstrate 1 are positioned in the substantially same plane.

Step of Cutting

As illustrated in FIG. 5(c), after hardening the resin 5, the hardenedresin 5 is cut along a cutting line 7 by dicing, for example, intoindividual light emitting elements. The cutting line 7 is set so as tomatch a center line between adjacent light emitting element chips 11,for example. A distance between the cutting line 7 and the side surfaceof the light emitting element chip 11 is set such that the thickness tof the reflecting layer 13 after the cutting is a predeterminedthickness.

In this manner, the light emitting element 10 including the lightemitting element chip 11, the light transmissive member 12 disposed onthe light-emitting surface of the light emitting element chip 11, thereflecting layer 13 covering the periphery of the light emitting elementchip 11 and the light transmissive member 12 is manufactured. Accordingto the light emitting element 10 of this embodiment, a leakage of lightthrough the side surface of the inner quadrangular prismatic body isprevented by providing the reflecting layer 13 on or over an entire sidesurface of the inner quadrangular prismatic body. However, the presentinvention is not limited to such an example. The reflecting layer may beprovided on or over a part of the side surface of the inner quadrangularprismatic body to restrict the light-emitting region to a predeterminedrange. For example, in the step of filling the resin, the resin 5constituting the reflecting layer 13 may be provided between thearranged inner quadrangular columnar bodies to a predetermined depth,and then the reflecting layer may be provided on or over a part of theside surface of the inner quadrangular prismatic body. Specifically,according to embodiments of the present invention, it is possible toappropriately set a region in which the reflecting layer 13 is providedon the side surface of the inner quadrangular prismatic body based on arequired light extracting efficiency, the shape of the package recess,and required directional characteristics.

The light emitting element 10 thus manufactured is mounted on the recessbottom surface 24 b of the base member 20 by flip-chip mounting, andthus the light emitting device according to an embodiment of the presentinvention is completed.

According to certain embodiments, the example in which the lighttransmissive member 12 is configured by the light transmissive substrate1 and the wavelength conversion layer 2 provided on one surface of thelight transmissive substrate 1 has been described. However, the presentinvention is not limited to such an example. For example, the lightemitting element 10 may be configured by providing the wavelengthconversion layer on or over the light emitting element chip 11, andproviding the transparent resin layer on or over the wavelengthconversion layer. Further, the light transmissive member 12 may beconfigured by a single resin layer containing the phosphor, or by asingle resin layer containing no phosphor. Moreover, the lighttransmissive member 12 may be configured by a plurality of resin layersincluding or not including the wavelength conversion layer 2.

In the light emitting device according to embodiments of the presentinvention, the recess 24 housing the light emitting element 10 isprovided so as to penetrate from the first surface 23 a to the secondsurface 23 b in the base member 20, and there are no upper and lowerwalls on the sides of the first surface 23 a and the second surface 23b. Therefore, the light emitting device according to an embodiment ofthe present invention may be made thin.

Further, as the reflecting layer 13 is provided on or over the sidesurface of the light emitting element 10, it is possible to efficientlyextract light from the light emitting element to the front side.

As the light emitting device according to an embodiment of the presentinvention thus configured has no upper and lower walls in the recess 24,it is possible to increase a ratio of a volume of the light emittingelement 10 in the recess 24, and to make its size smaller and thinner.Specifically, if the recess has upper and lower walls, it is necessaryto provide a gap above a predetermined level between the upper and lowerwalls and the light emitting elements in order to facilitate mounting ofthe light emitting element, the present invention does not require suchan extra space for mounting. Furthermore, the upper and lower walls isrequired to be inclined in order to cause light from the light emittingelement to be efficiently reflected to a front side in the configurationin which the reflecting layer is provided for the upper and lower walls.Therefore, it is necessary to provide a gap between the upper and lowerwalls and the light emitting element in order to allow the upper andlower walls to be inclined. However, with the present invention, it isnot necessary to provide a gap for such a purpose. Therefore, it is notnecessary to provide an extra gap in addition to the thickness of theupper and lower walls that prevents the light emitting device from beingmade thinner, and the light emitting device may be substantially made asthin as the thickness of the light emitting element 10.

As described above, according to embodiments of the present invention,it is possible to provide an extremely small and thin side-view typelight emitting device capable of efficiently extracting light from thelight emitting element to the front side.

Further, according to embodiments of the light emitting device of thepresent invention, the reflecting layer 13 is provided integrally withthe light emitting element 10 spaced apart from the side walls of therecess, and therefore it is possible to restrict the light-emittingregion to a narrower region, and effectively to a predetermined range.Here, the expression that the reflecting layer 13 is spaced apart fromthe side walls of the recess means that there is a distance between thereflecting layer 13 and the side walls of the recess as compared to thecase in which the reflecting layer is provided for the side walls of therecess, and a part of the reflecting layer may be in contact with theside walls of the recess, for example.

Specifically, while it is difficult to restrict the light-emittingregion to a region narrower than an opening of the recess with theconventional light emitting device configured such that the reflectinglayer is provided for the upper and lower walls and the side walls ofthe recess, the light emitting device according to an embodiment of thepresent invention is able to restrict the light-emitting region to adesired region by appropriately setting a region in which the reflectinglayer 13 is provided.

In the resin-molded body 23, the first surface 23 a includes the steppedportion on each of the side of the first end surface 23 d and the sideof the second end surface 23 e, and a reservoir for a bonding member(such as soldering) is provided on each of the sides of the first lead21 and the second lead 22 exposed from the resin-molded body 23. Withthis, it is possible to prevent the light emitting device from floatingwhen mounted, and to suppress an increase of the height when mounting.

Furthermore, the light emitting device according to embodiments of thepresent invention improves the heat radiation characteristics using thecolumnar-shaped first lead 21 and the columnar-shaped second lead 22.Specifically, if the first lead and the second lead are configured usingmetal flakes as in the conventional technique, the heat radiationcharacteristics deteriorate as the first lead and the second lead becomesmaller and thinner. However, the light emitting device according toembodiments of the present invention improves the heat radiationcharacteristics by increasing a ratio of metallic components thatconstitute the first lead 21 and the second lead 22 in the resin-moldedbody 23 using the columnar-shaped first lead 21 and the columnar-shapedsecond lead 22. It is preferable that the ratio of the metalliccomponents that constitute the first lead 21 and the second lead 22 inthe resin-molded body 23 is as high as possible. This is because boththe heat radiation characteristics and facility for implementation areimproved as the ratio of the leads increases.

Further, in the resin-molded body 23, the first surface 23 a includesthe stepped portion on each of the side of the first end surface 23 dand the side of the second end surface 23 e, and an area of the firstlead 21 and the second lead 22 exposed from the resin-molded body 23 onthe side of the first end surface 23 d and on the side of the second endsurface 23 e is increased. With this, it is possible to more effectivelyradiate heat in an actual implementation.

What is claimed is:
 1. A light emitting device comprising: a base membercomprising: a pair of leads; and a resin-molded body integrated with thepair of leads, wherein the base member has an upper surface, a lowersurface opposed to the upper surface, a first side surface, a secondside surface opposed to the first side surface, a third side surface,and a fourth side surface opposed to the third surface, and wherein arecess is on the upper surface, the recess having a pair of continuoussloping side walls opposed to each other and a bottom surface on whichthe pair of leads are disposed, and the recess being opened on the thirdside surface and the fourth side surface; and a light emitting elementcomprising: a light emitting element chip; a light transmissive memberdisposed on or over an upper surface of the light emitting element chipand comprising a light transmissive substrate; and a reflecting layercovering a periphery of the light emitting element chip and the lighttransmissive member, wherein the light emitting element is disposed onthe bottom surface of the recess, and wherein the reflecting layer isspaced apart from the pair of continuous sloping side walls of therecess.
 2. The light emitting device according to claim 1, wherein thebase member further comprises a first dent opened at the first sidesurface and the third side surface and a second dent opened at thesecond side surface and the third side surface.
 3. The light emittingdevice according to claim 1, wherein the pair of continuous sloping sidewalls of the recess are inclined such that an opening side of the recessis greater than the bottom surface of the recess.
 4. The light emittingdevice according to claim 1, wherein a planar shape of the lighttransmissive substrate is larger in size than that of the light emittingelement chip.
 5. The light emitting device according to claim 1, whereinthe light transmissive member comprises a wavelength conversion layerdisposed on one surface of the light emitting element chip side.
 6. Thelight emitting device according to claim 5, wherein the wavelengthconversion layer is disposed on the light emitting element chip via anadhesive member.
 7. The light emitting device according to claim 1,wherein the base member further comprises a first dent opened at thefirst side surface and the third side surface and a second dent openedat the second side surface and the third side surface, and wherein thepair of continuous sloping side walls of the recess are inclined suchthat an opening side of the recess is greater than the bottom surface ofthe recess.
 8. The light emitting device according to claim 1, whereinthe base member further comprises a first dent opened at the first sidesurface and the third side surface and a second dent opened at thesecond side surface and the third side surface, and wherein a planarshape of the light transmissive substrate is larger in size than that ofthe light emitting element chip.
 9. The light emitting device accordingto claim 1, wherein the base member further comprises a first dentopened at the first side surface and the third side surface and a seconddent opened at the second side surface and the third side surface, andwherein the light transmissive member comprises a wavelength conversionlayer disposed on one surface of the light emitting element chip side.10. The light emitting device according to claim 1, wherein the basemember further comprises a first dent opened at the first side surfaceand the third side surface and a second dent opened at the second sidesurface and the third side surface, wherein the light transmissivemember comprises a wavelength conversion layer disposed on one surfaceof the light emitting element chip side, and wherein the wavelengthconversion layer is disposed on the light emitting element chip via anadhesive member.
 11. The light emitting device according to claim 1,wherein the base member further comprises a first dent opened at thefirst side surface and the third side surface and a second dent openedat the second side surface and the third side surface, wherein the pairof continuous sloping side walls of the recess are inclined such that anopening side of the recess is greater than the bottom surface of therecess, and wherein a planar shape of the light transmissive substrateis larger in size than that of the light emitting element chip.
 12. Thelight emitting device according to claim 1, wherein the base memberfurther comprises a first dent opened at the first side surface and thethird side surface and a second dent opened at the second side surfaceand the third side surface, wherein the pair of continuous sloping sidewalls of the recess are inclined such that an opening side of the recessis greater than the bottom surface of the recess, and wherein the lighttransmissive member comprises a wavelength conversion layer disposed onone surface of the light emitting element chip side.
 13. The lightemitting device according to claim 1, wherein the base member furthercomprises a first dent opened at the first side surface and the thirdside surface and a second dent opened at the second side surface and thethird side surface, wherein the pair of continuous sloping side walls ofthe recess are inclined such that an opening side of the recess isgreater than the bottom surface of the recess, wherein the lighttransmissive member comprises a wavelength conversion layer disposed onone surface of the light emitting element chip side, and wherein thewavelength conversion layer is disposed on the light emitting elementchip via an adhesive member.
 14. The light emitting device according toclaim 1, wherein the base member further comprises a first dent openedat the first side surface and the third side surface and a second dentopened at the second side surface and the third side surface, whereinthe pair of continuous sloping side walls of the recess are inclinedsuch that an opening side of the recess is greater than the bottomsurface of the recess, wherein a planar shape of the light transmissivesubstrate is larger in size than that of the light emitting elementchip, and wherein the light transmissive member comprises a wavelengthconversion layer disposed on one surface of the light emitting elementchip side.
 15. The light emitting device according to claim 1, whereinthe base member further comprises a first dent opened at the first sidesurface and the third side surface and a second dent opened at thesecond side surface and the third side surface, wherein the pair ofcontinuous sloping side walls of the recess are inclined such that anopening side of the recess is greater than the bottom surface of therecess, wherein a planar shape of the light transmissive substrate islarger in size than that of the light emitting element chip, wherein thelight transmissive member comprises a wavelength conversion layerdisposed on one surface of the light emitting element chip side, andwherein the wavelength conversion layer is disposed on the lightemitting element chip via an adhesive member.